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VWN Printer Friendly News: ICME 2017 - IEEE International Conference on Multimedia and Expo

 ICME 2017 - IEEE International Conference on Multimedia and Expo
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Date posted: 03/03/2017
Posted by: Bill Walton
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July 10th 2017 – July 14th , 2017
Hong Kong

The IEEE International Conference on Multimedia & Expo (ICME) is a multimedia conference, which has been sponsored by four IEEE societies since 2000. It serves as a forum to promote the exchange of the latest advances in multimedia technologies, systems and applications, from both the research and development perspectives of the circuits and systems, communications, computer, and signal processing communities.

An Exposition of multimedia products, animations and industries will be held in conjunction with the conference. The theme of the 2017 conference will be “The New Media Experience”, enabling next generation 3D/AR/VR experiences and applications, based on which various sessions and events will be organized.

Topics of interest include, but are not limited to:

* Speech, audio, image, video, text and new sensor signal processing
* Signal processing for media integration
* Interactive 3D media and immersive VR/AR environments
* Multi-modal multimedia computing systems and human-machine interaction
* Multimedia Cloud and Big Data
* Multimedia IoT
* Mobile Multimedia Systems and Applications
* Multimedia compression
* Multimedia security, privacy, and content protection
* Multimedia databases and digital libraries
* Multimedia applications and services
* Media content analysis, analytics, and search
* Hardware and software for multimedia systems
* Multimedia standards and related issues
* Multimedia quality assessment

ICME 2017 will showcase high quality oral and poster presentations and demonstration sessions. Best paper awards (one diamond and five platinum awards) will be selected and recognized in the conference. Several awards sponsored by industry and institutions will be given out. Accepted papers have to be registered and presented; otherwise they will not be included in the IEEE Xplore Library.

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