Untitled Document
Not a member yet? Register for full benefits!

 Samsung Builds Thinner Chip Package

This story is from the category Computing Power
Printer Friendly Version
Email to a Friend (currently Down)



Date posted: 12/01/2005

On Tuesday, Samsung announced they have found a way found a way to increase memory while allowing for the ever-thinner profile of mobile devices.

Its eight-die multichip package (MCP) creates an eight-layer chip stack 1.4 mm thick, the space normally taken up by four chips. The chips have a capacity of 3.2 GB.

"Multi-chip packaging is a technology primarily used to circumvent the SoC [system-on-chip] process," Jim Walker, vice president of research for semiconductor manufacturing at Gartner/Dataquest, told TechNewsWorld. "It does so at lower final cost and faster time to market."

See the full Story via external site: www.technewsworld.com

Most recent stories in this category (Computing Power):

19/02/2017: Printable solar cells just got a little closer

04/02/2017: 1,000x more efficient nano-LED offers possibility of faster processors

31/01/2017: For this metal, electricity flows, but not heat

26/01/2017: Google brings AI to Raspberry Pi

12/01/2017: Researchers turn memory chips into processors to speed up computing tasks

08/01/2017: Intel announces Compute Card – A full PC the size of a Credit Card

23/12/2016: Scalable energy harvesting of unused mechanical energy in the environment

28/11/2016: Japan kicks off AI supercomputer project