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 Samsung Builds Thinner Chip Package

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Date posted: 12/01/2005

On Tuesday, Samsung announced they have found a way found a way to increase memory while allowing for the ever-thinner profile of mobile devices.

Its eight-die multichip package (MCP) creates an eight-layer chip stack 1.4 mm thick, the space normally taken up by four chips. The chips have a capacity of 3.2 GB.

"Multi-chip packaging is a technology primarily used to circumvent the SoC [system-on-chip] process," Jim Walker, vice president of research for semiconductor manufacturing at Gartner/Dataquest, told TechNewsWorld. "It does so at lower final cost and faster time to market."

See the full Story via external site: www.technewsworld.com



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