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 NEC Develops a Three-Dimensional Chip-Stacked Flexible Memory

This story is from the category Computing Power
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Date posted: 10/02/2009

NEC Corporation has announced the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic (excluding embedded memory cores) and memory chips (chip-stacked flexible memory) that are closely stacked by using a three-dimensional packaging technology.

NEC developed both a reconfigurable-memory technology that enables the memory chip to change its configuration flexibly, in addition to a memory-data transmission technology that reduces chip-area and latency caused by memory reconfiguration mechanisms.

See the full Story via external site: www.physorg.com



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